特点：Low loss and high attenuation;
Ultra small size;
Light weight and low profile;
For RFFE module use;
应用：4G LTE, 5G, etc.
晶圆级封装（WLP）
特点：Low loss and high attenuation;
Ultra small size;
Light weight and low profile;
RoHS compliant;
High resistance to molding pressure;
For RFFE module use;
应用：4G LTE, 5G, etc.
芯片级封装（CSP）
特点：Low loss and high attenuation Small size and light weight;
RoHS compliant;
应用：4G LTE, 5G, etc.
芯片级封装（CSP）
特点：Compact (1.4 x 1.1 x 0.5 mm typ., );
RoHS compliant;
MSL3;
应用：IMS, LPWA, etc.
陶瓷封装（Ceramic）
特点：Compact (3.0 x 3.0 mm typ., );
RoHS compliant;
MSL1;
应用：IMS, LPWA, etc.
芯片级封装（CSP）
特点：Ultra compact (1.4 x 1.1 x 0.56 mm typ., );
RoHS compliant;
AEC-Q200 compliant;
MSL3;
应用：Navigation system;
Bluetooth low energy;
陶瓷封装（Ceramic）
特点：Compact (3.0 x 3.0 x 1.05 mm typ., );
RoHS compliant;
AEC-Q200 compliant;
MSL1;
应用：Body control module(RKE,TPMS);
Navigation system;
Bluetooth low energy etc.
陆上移动卫星通讯（Land Mobile）
特点：Compact (3.0 x 3.0 mm typ., );
2in1 filter;
RoHS compliant;
MSL1;
应用：Land Mobile
基站（Basesation）
特点：Compact (3.0 x 3.0 mm typ., );
RoHS compliant;
MSL1;
